Stress isolated mems structures and methods of manufacture

摘要

A MEMS pressure sensor may be manufactured to include a backing substrate (104) having a diaphragm backing portion (106) and a pedestal portion (108). A diaphragm substrate (102) may be manufactured to include a pedestal portion (110) and a diaphragm (112) that is mounted to the diaphragm backing portion (106) of the backing substrate (104) to form a stress isolated MEMS die (101). The pedestal portions of the backing and diaphragm substrates form a pedestal (116) of the stress isolated MEMS die (101). The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.