METHOD FOR REPLACING BAD ARRAY BOARD IN THE PRINTED CIRCIUT BOARD

摘要

The present invention relates to a method of replacing a bad array board in a printed circuit board which cuts a bad array board in the printed circuit board including plural array boards, aligns a good array board on an empty space of a mother plate formed by the cutting of the bad array board, and then combines the good array board with the mother plate by filling gaps between both cutting surfaces with an adhesive. The printed circuit board indicates a multiple alignment printed circuit board where function test terminals are separately formed on a dummy part of a PCB panel and each of the function test terminals is connected to the corresponding circuit pattern of the array board through a bridge. A metal layer of the cut surface of the good array board for the replacing is connected electrically to a metal layer of the cut surface of the mother plate on which the bad array board is cut by using a conductive line on an adhesive surface of an adhesive tape. It is possible to replace the bad array board with the good array board while maintaining a function test function, and thus the multiple alignment printed circuit board may be used by replacing the bad array board with the good array board though defects occurs unlike the conventional multiple alignment printed circuit board discarded if defects occurs on any array board. Accordingly, environmental pollution due to discarding of the printed circuit board is reduced, and specially the method downs a manufacturing unit price by sharply increasing working yield through electrical connection of both metal layers using the conductive line on the adhesive surface of the adhesive tape, thereby exceedingly reducing a manufacturing cost.