| 发明名称 | Speaker module | ||
| 摘要 | A speaker module includes a speaker, a bracket and a pair of conductive pins. The bracket holds the speaker. The pair of pins is arranged diagonally on the corners of the bracket and is configured for mounting to and electrically connecting the speaker with a PCB. | ||
| 申请公布号 | US9247330(B2) | 申请公布日期 | 2016.01.26 |
| 申请号 | US201313928511 | 申请日期 | 2013.06.27 |
| 申请人 | Chi Mei Communication Systems, Inc. | 发明人 | Lee Hsiao-Yuan |
| 分类号 | H04R1/02;H04R1/06;H01R12/70;H01R12/71 | 主分类号 | H04R1/02 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A speaker module, comprising: a speaker; a bracket holding the speaker, the bracket defining four receiving grooves on four corners; only one pair of conductive pins for electrically connecting the speaker with a PCB being arranged diagonally in two diagonal receiving grooves on two diagonal corners of the bracket, wherein there is no other conductive pin for electrically connecting the speaker with the PCB arranged on the bracket. | ||
| 地址 | New Taipei TW | ||