Epoxy resin composition, prepreg and fiber-reinforced composite material

摘要

An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.

主权项

1. An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] and [Ab] as defined below, the amine-based curing agent [B] is diaminodiphenylsulfone, and the block copolymer [C] is defined below:
[Aa] is an epoxy resin having at least one structure selected from a condensed polycyclic structure and oxazolidone ring structure, wherein the condensed polycyclic structure is at least one structure selected from a naphthalene structure, and fluorene structure; [Ab] is a polyfunctional amine epoxy resin [Ab1] and a liquid bisphenol epoxy resin [Ab2]; [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M; wherein
the aforementioned respective blocks are linked by a covalent bond or are linked by an intermediate molecule connected with one block by one covalent bond and with the other block by another covalent bond;block M is a block consisting of a copolymer containing at least 50 wt % of methyl methacrylate and a comonomer with an SP value higher than that of methyl methacrylate;block B is a block immiscible with the block M and has a glass transition temperature of 20° C. or lower; andblock S is a block immiscible with the blocks B and M and has a glass transition temperature higher than the glass transition temperature of the block B; and wherein epoxy resin [A] contains 30 to 70 mass % of component [Aa], 25 to 50 mass % of component [Ab1] and 10 to 40 mass % of component [Ab2], based on 100 mass % of epoxy resin [A], and the block copolymer [C] is present in an amount of 1 to 10 parts by mass per 100 parts by mass of epoxy resin [A].