Semiconductor device and fabricating process for the same

摘要

A semiconductor device and a fabricating process for the same are provided. The semiconductor device includes a base layer having a part of a reactive material; and a self-assembled protecting layer of a self-assembled molecule reacting with the reactive material formed over the part.

主权项

1. A semiconductor device, comprising:
a base layer including a first conductive feature and a second conductive feature; a self-assembled protecting layer formed over the first conductive feature, the self-assembled protecting layer comprising a self-assembled molecule reacted with the first conductive feature; a dielectric layer formed on and contacting each of the self-assembled protecting layer and the base layer; and an opening formed through the dielectric layer, the opening exposing a top surface of the second conductive feature, wherein the top surface of the second conductive feature in the opening is free of the self-assembled protecting layer.