| 发明名称 | Imaging device, imaging apparatus, production apparatus and method, and semiconductor device | ||
| 摘要 | There is provided an imaging device including a semiconductor having a light-receiving portion that performs photoelectric conversion of incident light, electrically conductive wirings, and a contact group including contacts that have different sizes and connect the semiconductor and the electrically conductive wirings. | ||
| 申请公布号 | US9245823(B2) | 申请公布日期 | 2016.01.26 |
| 申请号 | US201414212300 | 申请日期 | 2014.03.14 |
| 申请人 | SONY CORPORATION | 发明人 | Ishii Shunsuke;Keino Satoshi;Wada Tomohiro |
| 分类号 | H01L31/02;H01L23/48;H01L27/146 | 主分类号 | H01L31/02 |
| 代理机构 | Hazuki International, LLC | 代理人 | Hazuki International, LLC |
| 主权项 | 1. An imaging device comprising: a semiconductor having a light-receiving portion configured to perform photoelectric conversion of incident light; electrically conductive wirings; and a contact group including a plurality of contacts that have different sizes and connect the semiconductor and the electrically conductive wirings, wherein, ground contacts within the contact group have different sizes, the ground contacts connecting a pixel well region of the semiconductor and the electrically conductive wirings to a ground potential. | ||
| 地址 | Tokyo JP | ||