发明名称 Heat dissipation structure for hand-held mobile device
摘要 A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.
申请公布号 US9244504(B2) 申请公布日期 2016.01.26
申请号 US201314034561 申请日期 2013.09.24
申请人 ASIA VITAL COMPONENTS CO., LTD. 发明人 Hsieh Kuo-Chun;Huang Chuan-Chin
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A heat dissipation structure for hand-held mobile device, comprising a supporting body; the supporting body having a first side and an opposite second side, and including at least one heat dissipation area, at where a heat dissipation element is located; and wherein the first side of the supporting body has at least one electronic element attached thereto and the second side of the supporting body is attached to at least one case member; and wherein the heat dissipation element has a heat absorption surface and an opposite heat dissipation surface; the heat absorption surface being in flat contact with at least one heat-producing unit, and the heat dissipation surface being in flat contact with the case member.
地址 New Taipei TW