发明名称 THREE DIMENSIONAL SYSTEM-ON-CHIP IMAGE SENSOR PACKAGE
摘要 An image sensor that comprises a first substrate and a plurality of photo detector assemblies disposed on or in the first substrate. Each of the photo detector assemblies comprises a photo detector formed on or in a second substrate and configured to generate an analog signal in response to received light, a converter formed on or in a third substrate, wherein the converter is electrically coupled to the photo detector and includes circuitry for converting the analog signal to a digital signal, a processor formed on or in a fourth substrate, wherein the processor is electrically coupled to the converter and includes circuitry for processing the digital signal.
申请公布号 HK1207204(A1) 申请公布日期 2016.01.22
申请号 HK20150107554 申请日期 2015.08.06
申请人 OPTIZ INC. 发明人 VAGE OGANESIAN;ZHENHUA LU
分类号 H01L 主分类号 H01L
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