| 发明名称 |
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME |
| 摘要 |
A composite electronic component includes: an insulating sheet; a tantalum capacitor including a body part containing a material formed of sintered tantalum powder particles and a tantalum wire partially embedded in the body part and disposed on the insulating sheet; a multilayer ceramic capacitor (MLCC) including a ceramic body in which dielectric layers and internal electrodes are alternatingly disposed and first and second external electrodes disposed on a lower surface of the ceramic body and disposed on the insulating sheet; and a molding part disposed to enclose the tantalum capacitor and the multilayer ceramic capacitor, wherein at least one of the tantalum capacitor and the multilayer ceramic capacitor includes a plurality of capacitors. |
| 申请公布号 |
US2016020031(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514635622 |
申请日期 |
2015.03.02 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SHIN Hong Kyu;CHOI Jae Hyuk;OH Hyun Sub |
| 分类号 |
H01G4/38;H01G4/12;H01G2/06;H01G4/248;H01G4/012;H01G4/30;H01G9/052 |
主分类号 |
H01G4/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composite electronic component comprising:
an insulating sheet; a tantalum capacitor including a body part containing a material formed of sintered tantalum powder particles and a tantalum wire partially embedded in the body part, and disposed on the insulating sheet; a multilayer ceramic capacitor (MLCC) including a ceramic body in which dielectric layers and internal electrodes are alternatingly disposed and first and second external electrodes disposed on a lower surface of the ceramic body, and disposed on the insulating sheet; and a molding part disposed to enclose the tantalum capacitor and the multilayer ceramic capacitor, wherein at least one of the tantalum capacitor and the multilayer ceramic capacitor includes a plurality of capacitors. |
| 地址 |
Suwon-Si KR |
