MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
摘要
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities (306) in a substrate (302). Wafer bonding may also be used to bond the substrate (302) to another substrate (304), such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.