| 发明名称 |
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE |
| 摘要 |
Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps. |
| 申请公布号 |
US2016017141(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201414771487 |
申请日期 |
2014.02.27 |
| 申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
MATSUMOTO Masaaki;HOSHINO Yasunori;YONEMOTO Tatsuo |
| 分类号 |
C08L65/00;C08J5/24;H05K1/03;C08L63/00;C08L33/08 |
主分类号 |
C08L65/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for a printed wiring board, comprising:
a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an expansion relief component including an acrylic resin that is soluble in an organic solvent, a content of the inorganic filler being 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent, and a melt viscosity of the resin composition at 130° C. being less than 50000 Ps. |
| 地址 |
Osaka JP |
