VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANSDUCERS HAVING BURIED CONTACTS AND ASSOCIATED SYSTEMS AND METHODS

摘要

Solid-state transducers (“SSTs”) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials.

主权项

1. A method of forming a high voltage light-emitting diode (HVLED), comprising:
forming a light-emitting transducer structure having a first side, a second side facing opposite the first side, a first semiconductor material at the first side, a second semiconductor material at the second side, and a light-emitting active region between the first semiconductor material and the second semiconductor material; forming a first contact at the first side of the transducer structure, the first contact being electrically coupled to the first semiconductor material; forming a plurality of features that separate the transducer structure and the first contact into a plurality of junctions, forming a second contact on each individual junction, the second contact electrically coupled to the second semiconductor material and extending from the first side of the transducer structure to the second semiconductor material; forming a passivation material over the first contact; exposing at least a portion of the first contact at each individual junction through the passivation material; and forming a plurality of interconnects between the second contact and the exposed first contact on adjacent junctions; wherein the plurality of junctions are electrically coupled in series via the plurality of interconnects.