| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a device as a whole, and to reduce power consumption.SOLUTION: A heat treatment device implementing heat treatment on an object placed inside of a device body 10, includes a cover body 30 for placing the object in a substantially-sealed space by being disposed in a state of covering the circumference of the object, an induction heating coil 40 disposed inside of the device body 10 in a state that a heat insulating plate 11 is disposed with respect to the object, and indirectly heating the object by heating a heating element 20 on which the object is placed, by induction heating in driving, atmosphere adjusting means for adjusting atmosphere of the space by supplying an inert gas to the space formed by the cover body 30, and a control portion for implementing the heat treatment of the object by driving the induction heating coil 40 when a heat treatment command is given, on the other hand, implementing cooling treatment on the object 1 by increasing supply of the inert gas by the atmosphere adjusting means by stopping the driving of the induction heating coil 40, in implementing the heat treatment on the object. |
