SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which improves electromigration resistance of wiring to improve reliability.SOLUTION: A semiconductor device comprises: an alloy layer which contains a first metal and a second metal and has a first part and a second part; and a conductive layer which is composed mostly of a nitride of the first metal sandwiched between the first part and the second part and the second metal laminated on the alloy layer.