| 发明名称 |
CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER MODULE USING WIRE-BONDING |
| 摘要 |
Provided are capacitive micromachined ultrasonic transducer (CMUT) modules. A CMUT module includes a CMUT chip which includes a plurality of first electrode pads on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC including a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads formed on the FPC so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads. |
| 申请公布号 |
US2016016197(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514665555 |
申请日期 |
2015.03.23 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIM Dongsik;HONG Seogwoo;CHUNG Seokwhan |
| 分类号 |
B06B1/02 |
主分类号 |
B06B1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitive micromachined ultrasonic transducer (CMUT) module comprising:
a CMUT chip which comprises a plurality of first electrode pads which are disposed on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC comprising a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads which are formed on the FPC and which correspond to respective ones of the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads. |
| 地址 |
Suwon-si KR |
