发明名称 POLISHING PAD AND POLISHING METHOD
摘要 The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
申请公布号 US2016016292(A1) 申请公布日期 2016.01.21
申请号 US201414774681 申请日期 2014.02.27
申请人 KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION ;FUJIBO HOLDINGS, INC. 发明人 DOI Toshiro;SESHIMO Kiyoshi;TAKAGI Masataka;KASHIWADA Hiroshi
分类号 B24D13/00 主分类号 B24D13/00
代理机构 代理人
主权项 1. A polishing pad comprising a polishing member having a polishing surface, wherein the polishing member comprises a material having dilatancy characteristics.
地址 Fukuoka-shi, Fukuoka JP