| 摘要 |
PROBLEM TO BE SOLVED: To provide a print circuit board which balances excellent wettability and anticorrosion of a solder coat for a component mounting part of a miniaturized metal conductor, and a manufacturing method of the same.SOLUTION: In a print circuit board, a solder resist 12 is formed to protect a metal conductor 13 forming a wiring pattern other than a metal conductor 15 that is to be a component mounting portion. Sufficient thickness of the solder resist on a surface of the metal conductor 13 other than the component mounting portion is secured. On the other hand, thickness of the solder resist 12 in the vicinity 16 of the metal conductor 15 to be the component mounting portion is thinner than other parts. Reduction in film thickness of the solder resist 12 in the vicinity 16 of the component mounting portion enables a solder coat to contact with the metal conductor to improve wettability of the solder coat. The solder resist 12 other than the vicinity of the component mounting portion has sufficient thickness on the surface of the metal conductor to obtain excellent anticorrosion. |
