SYSTEM AND METHOD FOR MACHINING HOLES ON WORKPIECE USING LASER PULSES

摘要

Disclosed are a system and method for machining holes on a workpiece using laser pulses. The system comprises: a laser emission device which emits laser pulses to a machining area of a workpiece (8), so as to machine holes in the machining area; an image collection device which collects an image of a hole machining area of the workpiece (8) in a process of machining the holes; and a positioning device (3) which is fixed to the laser emission device, wherein the image collection device is fixed to the positioning device (3), and the positioning device (3) can drive the image collection device to move in an optical axis direction, so as to adjust the distance between the image collection device and the hole machining area of the workpiece (8). The system is simple in structure, and convenient in use. Compared with a manner of adjusting a position of an image collection device using an optical path design, the positioning device (3) is simple in structure, low in costs and convenient in operation.