| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of n die(s), wherein n≧1. The substrate has a first side, a second side and an opening extending from the first side to the second side. The die stack is disposed in the opening. The thickness of the substrate is substantially the same as the thickness of the die stack. |
| 申请公布号 |
US2016020175(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201414479526 |
申请日期 |
2014.09.08 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Kuo Chien-Li |
| 分类号 |
H01L23/538;H01L21/78;H01L21/56 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a substrate having a first side, a second side and an opening extending from the first side to the second side; and a die stack of n die(s) disposed in the opening, wherein n≧1; wherein the thickness of the substrate is substantially the same as the thickness of the die stack. |
| 地址 |
HSINCHU TW |
