| 发明名称 |
MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUFACTURING MOLDED SENSOR PACKAGES WITH AN INTEGRATED MAGNET |
| 摘要 |
A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die. |
| 申请公布号 |
US2016018476(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201414336305 |
申请日期 |
2014.07.21 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Ooi Choo Tian;Tai Chew Theng;Elian Klaus;Mohd Tahir Mohd Hirzarul Hafiz |
| 分类号 |
G01R33/00 |
主分类号 |
G01R33/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a molded sensor package, the method comprising:
loading a magnet and a leadframe having a sensor die attached to the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool; molding the magnet and the sensor die with the same molding compound while loaded in the molding tool; and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die. |
| 地址 |
Neubiberg DE |
