POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.

主权项

1. A chemical mechanical polishing system, comprising:
a substrate support configured to hold a substrate during a polishing operation; a polishing pad support; a polishing pad held by the pad support, the polishing pad having an upper portion secured to the polishing pad support and a lower portion projecting downward from the upper portion, wherein an upper surface of the upper portion abuts the polishing pad support, a bottom surface of the lower portion provides a contact surface to contact a top surface of the substrate during polishing, the contact surface being smaller than the top surface of the substrate, and the upper portion has a first lateral dimension and the lower portion has a second lateral dimension that is less than the first lateral dimension; and a drive system configured to generate relative motion between the substrate support and the polishing pad support.