POLISHING COMPOSITION

摘要

Provided is a polishing composition whereby polishing rate can be enhanced while good surface quality is realized. The present invention provides a polishing composition including silica particles as abrasive grains and a basic compound as a polishing accelerator. The ratio (A/B) of the total surface area A [m2/kg composition] of the abrasive grains included in 1 kg of the polishing composition with respect to the total volume B [m3/kg composition] of the abrasive grains included in 1 kg of the polishing composition is 7.0 × 107 or greater.