发明名称 MODULE
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device with high reliability of non-destruction by external local pressure while achieving thinning, and further, to manufacture the light-emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacturing process.SOLUTION: By sealing a light-emitting element with first and second structures with organic resin impregnated in a fiber body, the light-emitting device with high reliability having strength can be provided while achieving thinning. Further, the light-emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
申请公布号 JP2016012576(A) 申请公布日期 2016.01.21
申请号 JP20150207927 申请日期 2015.10.22
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 OIKAWA YOSHIAKI;EGUCHI SHINGO;MASUYAMA MITSUO;KATANIWA MASATOSHI;SHOJI HIRONOBU;NAKATA MASATAKA;SEO TETSUSHI
分类号 H05B33/04;H01L51/50;H05B33/02;H05B33/06;H05B33/14;H05B33/26 主分类号 H05B33/04
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