POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION

摘要

A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer on the substrate and before deposition of an outer layer over the at least one layer. After deposition of the outer layer and during polishing of the outer layer on the substrate, a sequence of raw measurements of the substrate during polishing are received from an in-situ monitoring system. Each raw measurement is normalized to generate a sequence of normalized measurements using the raw measurement and the base measurement. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized measurement from the sequence of normalized measurements.