The present invention comprises an inlay 10 comprising an IC chip 11 and an antenna 12; a planar auxiliary antenna 20 laminated on the inlay 10 in an insulating state to the inlay 10; and a substrate 50 on which the inlay 10 and the auxiliary antenna 20 are laminated. The auxiliary antenna 20 is formed into a rectangular planar shape including long sides each having a length of substantially 1/4 of a wavelength of a radio wave frequency of the inlay 10, and has a cutout part 21 which divides one of the long sides into two parts each having a length of substantially 1/8 of the wavelength of the radio wave frequency of the inlay 10. And the cutout part 21 is formed into a concave shape which is opened in an edge portion of the one long side and has a predetermined width and depth to allow the IC chip 11 of the inlay 10 to be disposed therein.
