| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that external vibrations are transmitted to a stage supporting a substrate through a driving part. <P>SOLUTION: A substrate bonding apparatus includes: a first stage supporting a first substrate from among multiple substrates; a second stage disposed so as to face the first stage and supporting a second substrate from among the multiple substrate; a decompression unit having a decompression chamber enclosing at least the first substrate and the second substrate which are respectively supported by the first stage and the second stage; a frame preventing vibrations from being transmitted from the decompression unit and supporting the first stage and the second stage; a driving part having a movable element fixed to one of the first stage and the second stage and a stator fixed to the decompression unit and relatively moving the first stage and the second stage. <P>COPYRIGHT: (C)2013,JPO&INPIT |
