| 摘要 |
Provided is a circuitry connecting material whereby close adhesion with an interface with a silicon nitride film can be enhanced and excellent connection reliability can be exhibited during subjection to a high-temperature high-humidity treatment. The circuitry connecting material contains: a multi-functional (meth)acrylate monomer (1); a radical polymerization initiator (2) for generating free radicals using heat or light; and a monofunctional (meth)acrylate monomer (3), the monofunctional (meth)acrylate monomer including a biphenyl group or a naphthalene group, and the position of binding between the biphenyl group or naphthalene group and an oxygen atom binding thereto being the ortho position, the meta position, or the para position. |
