| 摘要 |
1,075,414. Semi-conductor devices. SIEMENS A.G. March 25, 1965 [March 26, 1964 (2)], No. 12606/65. Heading H1K. Individual semi-conductor bodies 1 are mounted at intervals along an elongated carrier member of conductive material (as shown, a gold-coated strip 2 of a nickel-cobalt-iron alloy) which acts as a transporting strip for subsequent operations, conductive junctions 23, 24 are established (e.g. by thermocompression) between electrodes on each of the semi-conductor bodies 1 and associated terminal electrodes carried by the carrier member (as shown, wires 5, 6 spot-welded at points 7 to the strip 2), each semi-conductor body and at least the conductive junction portion (23, 24) of each terminal electrode are encapsulated in a body 8 of potting compound, and the carrier member and terminal electrodes are severed (as shown, along dotted lines 9, 10) to form a plurality of discrete encapsulated semi-conductor devices, each provided with projecting terminal electrodes: In alternative embodiments, the carrier member and terminal electrodes take the form of a plurality of parallel wires joined by bridge pieces at intervals (Figs. 5 to 7, not shown), or of patterns stamped on a metal strip (Figs. 8 to 19, not shown) which may provide terminal electrodes for several components of a circuit. |
