发明名称 半導体デバイス
摘要 A semiconductor device includes a first conductivity type base formed on a surface of a substrate, a second conductivity type emitter formed on a surface of the base, a second conductivity type doped region which, along with accepting a first type of carrier from the emitter, injects the first type of carrier into the base, and is arranged to be spaced apart on the surface of the base from the emitter, and a second conductivity type collector which is formed on an opposite side to the emitter and the doped region, interposing the base.
申请公布号 JP5845804(B2) 申请公布日期 2016.01.20
申请号 JP20110235046 申请日期 2011.10.26
申请人 ソニー株式会社 发明人 森 日出樹
分类号 H01L21/331;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06;H01L29/732 主分类号 H01L21/331
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