| 摘要 |
A method and apparatus for producing a radio frequency absorbing (RFA) or perfect microwave absorbing (PMA) printed circuit board (PCB) is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA PCB, which may comprise a multi-layered assembly for absorption of electromagnetic radiation in a targeted frequency range such as the microwave frequency range in the PCB. |
