| 摘要 |
The present invention relates to a hybrid cutting apparatus for tempered glass and a method for cutting tempered glass using the same. The hybrid cutting apparatus for tempered glass comprises: a protective film processing unit for attaching or removing a protective film to perform dry etching on tempered glass; a dry etching unit for dry-etching the tempered glass from the surface of the tempered glass to a predetermined depth along an expected cutting line of the tempered glass; and a laser cutting unit for cutting the tempered glass by emitting laser beam toward the expected cutting line of the tempered glass on which the dry etching operation is completed. |
