| 摘要 |
The present invention relates to a thin layer depositing apparatus, and more specifically relates to a linear source for evaporating a deposition material to form a thin layer on a substrate and a thin layer depositing apparatus having the same, to precisely control an evaporation direction of the deposition material with respect to the substrate treatment surface to conduct a process for more uniformly treating a substrate. The linear source may comprise: a cylinder part which has a length in a horizontal direction parallel to a surface of the substrate, and has a plurality of nozzles installed on the upper side, spraying the deposition material to the upper side, and has an internal space; one or more connection parts which are connected with the cylinder part to communicate with the internal space, and protrude toward the lower side of the cylinder part; a crucible part which is connected to a lower end of the connection part, and is filled with the deposition material. The linear source has a first temperature control area comprising the crucible part, a second temperature control area comprising the connection part and having a higher temperature than that of the first temperature control area, a third temperature control area comprising the cylinder part and having a higher temperature than that of the second temperature control area, and a fourth temperature control area comprising the plurality of nozzles and having a higher temperature than that of the third temperature control area. The first to the fourth temperature control areas are controlled to be a higher temperature that an evaporation temperature of the deposition material, and are installed with independently controlled heaters, respectively. |
