发明名称 Semiconductor device and method for fabricating the same
摘要 Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a gate structure formed on a substrate, a source/drain extension formed at one side of the gate structure while not being formed at the other side of the gate structure, and doped with a first type impurity, a halo region formed at one side of the gate structure while not being formed at the other side of the gate structure, and doped with a second type impurity different from the first type impurity, a first source/drain region formed at one side of the gate structure and doped with the first type impurity, and a second source/drain region formed at the other side of the gate structure and doped with the first type impurity.
申请公布号 US9240409(B2) 申请公布日期 2016.01.19
申请号 US201414327858 申请日期 2014.07.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Son Seung-Hun
分类号 H01L27/088;H01L29/78;H01L29/08 主分类号 H01L27/088
代理机构 Lee & Morse, P.C. 代理人 Lee & Morse, P.C.
主权项 1. A semiconductor device, comprising: a gate structure on a substrate; a source/drain extension at a first side of the gate structure and doped with a first type impurity; a halo region at the first side of the gate structure and doped with a second type impurity different from the first type impurity; a first source/drain region at the first side of the gate structure and doped with the first type impurity; a second source/drain region formed at a second side of the gate structure and doped with the first type impurity; and a first recess and a second recess at the first side and the second side of the gate structure in the substrate, the first source/drain region and the second source/drain region being in the first recess and the second recess, respectively, wherein the source/drain extension and the halo region are only at one side of the gate structure.
地址 Suwon-si, Gyeonggi-do KR