发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a gate structure formed on a substrate, a source/drain extension formed at one side of the gate structure while not being formed at the other side of the gate structure, and doped with a first type impurity, a halo region formed at one side of the gate structure while not being formed at the other side of the gate structure, and doped with a second type impurity different from the first type impurity, a first source/drain region formed at one side of the gate structure and doped with the first type impurity, and a second source/drain region formed at the other side of the gate structure and doped with the first type impurity. |
申请公布号 |
US9240409(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201414327858 |
申请日期 |
2014.07.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Son Seung-Hun |
分类号 |
H01L27/088;H01L29/78;H01L29/08 |
主分类号 |
H01L27/088 |
代理机构 |
Lee & Morse, P.C. |
代理人 |
Lee & Morse, P.C. |
主权项 |
1. A semiconductor device, comprising:
a gate structure on a substrate; a source/drain extension at a first side of the gate structure and doped with a first type impurity; a halo region at the first side of the gate structure and doped with a second type impurity different from the first type impurity; a first source/drain region at the first side of the gate structure and doped with the first type impurity; a second source/drain region formed at a second side of the gate structure and doped with the first type impurity; and a first recess and a second recess at the first side and the second side of the gate structure in the substrate, the first source/drain region and the second source/drain region being in the first recess and the second recess, respectively, wherein the source/drain extension and the halo region are only at one side of the gate structure. |
地址 |
Suwon-si, Gyeonggi-do KR |