发明名称 Bonding material and bonding method using the same
摘要 A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.
申请公布号 US9240256(B2) 申请公布日期 2016.01.19
申请号 US201013576014 申请日期 2010.04.23
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 Endoh Keiichi;Hisaeda Yutaka;Miyazawa Akihiro;Nagahara Aiko;Ueyama Toshihiko
分类号 C09J11/06;H01B1/02;B22F1/00;B82Y30/00;H01L23/00;H05K3/32;B22F7/06;B22F9/24;C22C5/06;H05K3/34 主分类号 C09J11/06
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A bonding material comprising: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 1-8 carbon atoms; a flux component of oxydiacetic acid; anda dispersion medium.
地址 Tokyo JP