发明名称 |
Bonding material and bonding method using the same |
摘要 |
A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower. |
申请公布号 |
US9240256(B2) |
申请公布日期 |
2016.01.19 |
申请号 |
US201013576014 |
申请日期 |
2010.04.23 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
Endoh Keiichi;Hisaeda Yutaka;Miyazawa Akihiro;Nagahara Aiko;Ueyama Toshihiko |
分类号 |
C09J11/06;H01B1/02;B22F1/00;B82Y30/00;H01L23/00;H05K3/32;B22F7/06;B22F9/24;C22C5/06;H05K3/34 |
主分类号 |
C09J11/06 |
代理机构 |
Greenblum & Bernstein, P.L.C. |
代理人 |
Greenblum & Bernstein, P.L.C. |
主权项 |
1. A bonding material comprising:
silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 1-8 carbon atoms; a flux component of oxydiacetic acid; anda dispersion medium. |
地址 |
Tokyo JP |