| 发明名称 | Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method | ||
| 摘要 | A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. | ||
| 申请公布号 | US9238278(B2) | 申请公布日期 | 2016.01.19 |
| 申请号 | US201214005874 | 申请日期 | 2012.01.25 |
| 申请人 | Panasonic Intellectual Property Management Co., Ltd. | 发明人 | Sakurai Daisuke |
| 分类号 | B23K35/02;B23K1/00;B32B3/24;B32B3/30;B23K1/20;B23K3/06;B23K35/26;H01L23/00;C22C13/00;B23K35/362;B23K35/40;C22C1/02;B22F7/00;H05K3/34 | 主分类号 | B23K35/02 |
| 代理机构 | RatnerPrestia | 代理人 | RatnerPrestia |
| 主权项 | 1. A solder transfer substrate, comprising: a base layer; an adhesive layer arranged on the base layer; and solder powder arranged on the adhesive layer, wherein in the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged, the base layer is larger than the adhesive layer in respect of a compression rate at a time of heating, and the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. | ||
| 地址 | Osaka JP | ||