Component mounting device, a component mounting method, an imaging device and an imaging method

摘要

A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a component by irradiating light to the component obliquely from below, and a second illuminating device, when the component adsorbed by the adsorbing nozzle and located in the imaging field of vision is a through hole component, only illuminate the downwards extending parts of the component by irradiating light at an irradiation angle closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating device to the component are included. That the component is illuminated by the first illuminating devices and that the component is illuminated by the second illuminating devices are switched based on whether the component is a surface mounted component or a through hole component.

主权项

1. A component mounting device, comprising
a board positioning unit which positions a board, a component supplying unit which supplies a component, an adsorbing nozzle which adsorbs the component supplied from the component supplying unit, an imaging unit which, when the component which is adsorbed by the adsorbing nozzle and is moved into an imaging field of vision is a surface mounted component which is to be surface mounted on the surface of the board, images the surface mounted component from below by illuminating the bottom surface of the surface mounted component with a first illuminating unit which irradiates light obliquely from below to the surface mounted component, and when the component which is adsorbed by the adsorbing nozzle and is moved into the imaging field of vision is an insertion component which has downwards extending parts that extend downwards, images the insertion component from below by only illuminating the downwards extending parts with a second illuminating unit which irradiates light at an irradiation angle which is closer to a horizontal direction irradiation than the irradiation angle of the light of the first illuminating unit to the insertion component, the second illuminating unit being provided at a position higher than the first illuminating unit, and a mounting control unit which, after the component is imaged by the imaging unit, grasps a posture of the component based on an image obtained through the imaging, and mounts the component on the board which is positioned by the board positioning unit based on the grasped posture.