| 摘要 |
PROBLEM TO BE SOLVED: To suppress a wiring edge part from exposing from an insulation film, thereby achieving a highly reliable electronic component.SOLUTION: An electronic component 1 includes: a substrate 10 that is a body part of the electronic component; a wiring 20 provided on the substrate 10 and having irregularities 22 at an edge part 21 as plan view; and an insulation film 30 provided on the substrate 10 and the wiring 20. Even when reduction in a film thickness is caused during a formation process where the insulation film 30 is formed using a resin material, the resin material is allowed to remain at the edge part 21 of the wiring 20 provided with the irregularities 22 so that the resin material existing on the edge part 21 is suppressed from becoming thinner, and accordingly the edge part 21 is suppressed from exposing from the formed insulation film 30. |
