发明名称 THERMAL TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermal treatment device preventing a height dimension from becoming high, and reducing an installation volume.SOLUTION: A thermal treatment device S1 includes: a heating device 2 that heats a treated object X; a cooling chamber 3a that performs cooling; and a transportation chamber 1 that is installed above the cooling chamber 3a, and in which transportation of the treated object X is performed. The thermal treatment device also includes a lifting mechanism 7 that has a lifting base 3d on which the treated object X is mounted and a drive device 7a that is installed above the lifting base 3d, and lifts/lowers the lifting base 3d between the cooling chamber 3a and the transportation chamber 1 by the drive device 7a.
申请公布号 JP2016008812(A) 申请公布日期 2016.01.18
申请号 JP20140131870 申请日期 2014.06.26
申请人 IHI CORP;IHI MACHINERY & FURNACE CO LTD 发明人 KATSUMATA KAZUHIKO;ISOMOTO KAORU;NAGATA TAKAHIRO;NAKAYAMA AKIRA;SHIMIZU YUSUKE;NISHITANI GEN
分类号 F27B9/14;C21D1/00;F27B9/02;F27B9/38;F27B9/39;F27B17/00 主分类号 F27B9/14
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