发明名称 SUBSTRATE HEATING APPARATUS, SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating apparatus which allows for uniform heating in the substrate plane, regardless of the substrate size, by using microwaves.SOLUTION: A supporting apparatus 5 has a plurality of microwave irradiation units 25 arranged, at a regular interval, in a direction parallel with a mounting surface 21a below a mounting plate 21. Each microwave irradiation unit 25 includes a microwave generator 41 generating microwaves, a microwave radiation port 43 radiating microwaves toward the mounting plate 21, a unit container 45 for supporting the microwave radiation port 43, and a microwave transmission path 47 for transmitting microwaves from the microwave generator 41 to the microwave radiation port 43.
申请公布号 JP2016009796(A) 申请公布日期 2016.01.18
申请号 JP20140130472 申请日期 2014.06.25
申请人 TOKYO ELECTRON LTD 发明人 NOMURA MASAMICHI;KASAI SHIGERU;KINOSHITA HIDETOSHI;MORITA YASUSHI;IIZUKA YOJI;MIURA HITOTSUGU
分类号 H01L21/205;C23C16/46;C30B35/00;H01L21/265;H01L21/324;H01L21/683;H05B6/70;H05B6/72;H05B6/74 主分类号 H01L21/205
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