| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor or electronic component mounting device such as a die bonder or a semiconductor device or electronic component mounting method, which does not cause blur or a gap in a recognition system caused by an optical system.SOLUTION: A semiconductor or electronic component mounting device comprises: an imaging mechanism for imaging a component related to a mounting device of a conductor component, an electronic component or a component; a first lighting mechanism connected with the imaging mechanism, for lighting the component imaged by the imaging mechanism; and a temperature maintenance mechanism connected with the imaging mechanism and the first lighting mechanism, for maintaining temperature of the first lighting mechanism. |
