LIGHT EMITTING DIODE SUBSTRATE MANUFACTURING METHOD AND LIGHTING DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce a time for forming wiring on a substrate.SOLUTION: A light emitting diode substrate manufacturing method comprises the processes of: forming a plurality of catalyst layers on a principal surface of a resin substrate at specified intervals by continuously coating a principal surface of the resin substrate at specified intervals with an ink containing a catalyst; forming conductive layers on the plurality of catalyst layers, respectively, by using an electroless plating method after the process of forming the plurality of catalyst layers; forming additional conductive layers on the conductive layer serving as a cathode after the process of forming the conductive layers by using the conductive layer lying at an end of the plurality of conductive layers as a first electrode and applying voltage so as to deposit metal on the conductive layer used as the first electrode; and connecting a light emitting diode to the additional conductive layer and the conductive layer adjacent to each other at specified intervals by using a connection member after the process of forming the additional conductive layers.