| 发明名称 |
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF |
| 摘要 |
A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a dielectric layer on the carrier; forming a plurality of conductive posts in the dielectric layer; and forming a cavity in the dielectric layer to expose the bonding pads, wherein the conductive posts are positioned around a periphery of the cavity, thereby simplifying the fabrication process. |
| 申请公布号 |
US2016013123(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201414562972 |
申请日期 |
2014.12.08 |
| 申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
Pai Yu-Cheng;Lin Chun-Hsien;Chiu Shih-Chao;Hsiao Wei-Chung;Sun Ming-Chen;Shen Tzu-Chieh;Chen Chia-Cheng |
| 分类号 |
H01L23/498;H05K1/11;H01L25/065;H01L21/48;H01L23/00;H01L25/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure, comprising:
a carrier having a plurality of bonding pads; a dielectric layer having opposite first and second surfaces and formed on the carrier via the first surface thereof, wherein at least a cavity is formed in the second surface of the dielectric layer to expose the bonding pads; and a plurality of conductive posts formed in the dielectric layer and positioned around a periphery of the cavity. |
| 地址 |
Taichung TW |
