发明名称 METHOD FOR MANUFACTURING SEALING KEY, SEALING KEY, AND SEALING DEVICE
摘要 A sealing key includes a container and an IC tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part. The IC tag component includes a base, an IC chip mounted on the base, and a circuit pattern formed on the base. The circuit pattern includes an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication in. A method for manufacturing the sealing key includes: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part.
申请公布号 US2016012328(A1) 申请公布日期 2016.01.14
申请号 US201514858672 申请日期 2015.09.18
申请人 Toppan Printing Co., Ltd. 发明人 YAMAOKA Keinosuke;NAKABAYASHI Takamitsu
分类号 G06K19/077;H01L23/31;H01L23/053;H01L21/56;H01L21/52 主分类号 G06K19/077
代理机构 代理人
主权项 1. A method for manufacturing a sealing key, the sealing key comprising a container and an IC tag component fixed inside the container, the container having a shape that includes a body part and an insertion part that protrudes from the body part, the IC tag component having a base, an IC chip mounted on the base, and a circuit pattern formed on the base, the circuit pattern including an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication, the method comprising: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part.
地址 Tokyo JP