发明名称 |
METHOD FOR MANUFACTURING SEALING KEY, SEALING KEY, AND SEALING DEVICE |
摘要 |
A sealing key includes a container and an IC tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part. The IC tag component includes a base, an IC chip mounted on the base, and a circuit pattern formed on the base. The circuit pattern includes an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication in. A method for manufacturing the sealing key includes: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part. |
申请公布号 |
US2016012328(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
US201514858672 |
申请日期 |
2015.09.18 |
申请人 |
Toppan Printing Co., Ltd. |
发明人 |
YAMAOKA Keinosuke;NAKABAYASHI Takamitsu |
分类号 |
G06K19/077;H01L23/31;H01L23/053;H01L21/56;H01L21/52 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a sealing key, the sealing key comprising a container and an IC tag component fixed inside the container, the container having a shape that includes a body part and an insertion part that protrudes from the body part, the IC tag component having a base, an IC chip mounted on the base, and a circuit pattern formed on the base, the circuit pattern including an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication, the method comprising:
arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part. |
地址 |
Tokyo JP |