发明名称 LED MODULE INCLUDING AN LED
摘要 An LED module includes a carrier plate having an arrangement face and a wall on the upper side of the plate, the wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; an LED arranged on the face; a contact element, to which the LED is connected; and an at least partially transparent potted body covering the arrangement face and the LED towards the top and laterally adjoins an inner face of the wall. The wall is formed monolithically with the remaining carrier plate and is interrupted over its periphery, and the potted body does not adjoin the inner wall face of the wall. The contact element extends away from the arrangement face along the upper side of the carrier plate in the interruption region so that electrical contact can be made with the LED via the contact element from outside the body.
申请公布号 US2016010808(A1) 申请公布日期 2016.01.14
申请号 US201514790033 申请日期 2015.07.02
申请人 Osram GmbH 发明人 Ghasemi Afshar Farhang
分类号 F21K99/00;F21V23/06;F21V3/00 主分类号 F21K99/00
代理机构 代理人
主权项 1. A light emitting diode module, comprising: a carrier plate, which has an arrangement face and a wall on the upper side of said carrier plate, said wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; a light emitting diode, which is arranged on the arrangement face; a contact element, to which the light emitting diode is electrically conductively connected; and an at least partially transparent potted body, which covers the arrangement face and the light emitting diode towards the top and laterally adjoins an inner wall face of the wall; wherein the wall is formed monolithically with the remaining carrier plate, i.e. is formed from the same continuous carrier plate material; wherein the wall is interrupted over its periphery in an interruption region, and the potted body does not adjoin the inner wall face of the wall there accordingly; wherein, in addition, the contact element extends away from the arrangement face along the upper side of the carrier plate in the interruption region so that electrical contact can be made with the light emitting diode via the contact element from outside the potted body.
地址 Munich DE