发明名称 |
Composite Formulation and Composite Product |
摘要 |
A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles. |
申请公布号 |
US2016012933(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
US201414329654 |
申请日期 |
2014.07.11 |
申请人 |
Tyco Electronics Corporation |
发明人 |
Das Jaydip;Gao Ting;Wang Jialing;Pugliano Nicola;Bharadwaj Kavitha;Lloyd Richard B. |
分类号 |
H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
1. A composite product formed from a composite formulation, the composite formulation comprising:
a polymer matrix; tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%; copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%; and solder flux blended into the polymer matrix at a concentration, by weight, of at least 0.2% for reducing or eliminating oxides in the copper-containing particles; wherein the tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles. |
地址 |
Berwyn PA US |