发明名称 Composite Formulation and Composite Product
摘要 A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.
申请公布号 US2016012933(A1) 申请公布日期 2016.01.14
申请号 US201414329654 申请日期 2014.07.11
申请人 Tyco Electronics Corporation 发明人 Das Jaydip;Gao Ting;Wang Jialing;Pugliano Nicola;Bharadwaj Kavitha;Lloyd Richard B.
分类号 H01B1/22 主分类号 H01B1/22
代理机构 代理人
主权项 1. A composite product formed from a composite formulation, the composite formulation comprising: a polymer matrix; tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%; copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%; and solder flux blended into the polymer matrix at a concentration, by weight, of at least 0.2% for reducing or eliminating oxides in the copper-containing particles; wherein the tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.
地址 Berwyn PA US