发明名称 CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle which is capable of decreasing connection resistance when establishing electrical connection between electrodes, and enhancing connection reliability between the electrodes at high temperatures.SOLUTION: A conductive particle includes a base material particle, a first conductive layer, and a gold layer containing gold. The first conductive layer is disposed on a surface of the base material particle. The gold layer is disposed on an outer surface of the first conductive layer. A crystallite size in the gold layer exceeds 15 nm and does not exceed 300 nm.
申请公布号 JP2016006764(A) 申请公布日期 2016.01.14
申请号 JP20150091648 申请日期 2015.04.28
申请人 SEKISUI CHEM CO LTD 发明人 NISHIOKA KEIZO;SASAHIRA MASAO
分类号 H01B5/00;B22F1/02;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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