发明名称 |
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle which is capable of decreasing connection resistance when establishing electrical connection between electrodes, and enhancing connection reliability between the electrodes at high temperatures.SOLUTION: A conductive particle includes a base material particle, a first conductive layer, and a gold layer containing gold. The first conductive layer is disposed on a surface of the base material particle. The gold layer is disposed on an outer surface of the first conductive layer. A crystallite size in the gold layer exceeds 15 nm and does not exceed 300 nm. |
申请公布号 |
JP2016006764(A) |
申请公布日期 |
2016.01.14 |
申请号 |
JP20150091648 |
申请日期 |
2015.04.28 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
NISHIOKA KEIZO;SASAHIRA MASAO |
分类号 |
H01B5/00;B22F1/02;H01B1/22;H01B5/16;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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