发明名称 LED LAMP HAVING A GOOD HEAT-DISSIPATING FUNCTION
摘要 A LED lamp having a good heat-dissipating function includes a thermal radiator of solid metal including a top surface downwardly sloping from a peak point thereof to the border, a plurality of granular bumps raised from the top surface and defining a plurality of flow paths thereamong, a recess curved inwardly from a bottom surface thereof, an eave surrounding the recess and an inner slope located at the inner side of the eave and obliquely upwardly extended from the lowest edge of the eave to the recess, a vapor chamber bonded with the top surface thereof to the bottom surface of the recess, a circuit module bonded with the top surface thereof to the bottom surface of the vapor chamber, and a LED unit mounted at the bottom surface of the circuit module.
申请公布号 US2016010842(A1) 申请公布日期 2016.01.14
申请号 US201314773214 申请日期 2013.03.08
申请人 CHIN CHI-TE 发明人 CHIN Chi-Te
分类号 F21V29/83;F21V1/00;F21K99/00 主分类号 F21V29/83
代理机构 代理人
主权项 1. A LED lamp having a good heat-dissipating function, comprising: a thermal radiator of solid metal, said thermal radiator comprising a top surface, an opposing bottom surface, a peak point located at the top surface of said thermal radiator, the top surface of said thermal radiator sloping from said peak point to the border of said thermal radiator, a plurality of bumps in a granular shape raised from and distributed over the top surface of said thermal radiator, a plurality of flow paths defined on the top surface of said thermal radiator by said bumps and sloping downwardly in direction from said peak point to the border of said thermal radiator, a recess inwardly curved from the bottom surface of said thermal radiator, said recess having a planar bottom surface, an eave surrounding said recess, and an inner slope located at an inner side of said eave and extending obliquely upwardly from the lowest edge of said eave to said recess; a vapor chamber having opposing top and bottom surfaces, the top surface of said vapor chamber being bonded to the planar bottom surface of said recess; a circuit module having opposing top surface and bottom surface, the top surface of said circuit module being bonded to the bottom surface of said vapor chamber; and at least one LED unit mounted at the bottom side of said circuit module.
地址 US