发明名称 Method for producing a thin coating on a substrate
摘要 <p>The method involves coupling a substrate (2) with a front team device such that the substrate is isotropic stretched with the team device. The substrate is held resilient with a predetermined bias. A thin layer material is separated on the substrate under action of heat so that a thin layer with the thin layer material is formed on the substrate. The substrate is decoupled from team device. The thin layer accompanied by the shrinkage is cooled. The predetermined bias is set high to prevent appearance of tensile stress in the thin layer accompanied by the shrinkage.</p>
申请公布号 EP2644740(A3) 申请公布日期 2016.01.13
申请号 EP20130158683 申请日期 2013.03.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 PITZER, DANA;SCHREITER, MATTHIAS;SCHUH, CARSTEN;STEINKOPFF, THORSTEN
分类号 C23C14/50;C23C14/08;C23C14/54;H01L21/302;H01L21/316;H01L41/053;H01L41/187;H01L41/257;H01L41/314;H01L41/316 主分类号 C23C14/50
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