发明名称 Conductive paste composition and method for manufacturing electrode
摘要 Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.
申请公布号 EP2886671(A3) 申请公布日期 2016.01.13
申请号 EP20140196255 申请日期 2014.12.04
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHIU, CHUN-YI;CHIOU, KUO-CHAN;HSIAO, WEI-HAN
分类号 C22C32/00;B22F1/00;C09D5/24;C09J9/02;H01B1/22;H01B1/24;H01L21/28;H01L31/0224 主分类号 C22C32/00
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