PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

Provided are a printed circuit board and a method for manufacturing the same. More specifically, according to an embodiment of the present invention, the printed circuit board comprises an insulating layer, and a circuit pattern and a dummy pattern formed on the insulating layer. The dummy pattern includes a first metal and a second metal different from each other, and thus can suppress or control the warpage, adjust impedance of the printed circuit board by using the dummy pattern with high resistance, and serve as a ground. In addition, since the dummy pattern has high thermal conductivity as compared to an insulating material, the heat dissipation properties of the printed circuit board can be enhanced.